High-Resolution SEM Imaging and Analysis
The Zeiss Ultra 60 FE-SEM has a minimum 1.1nm resolution utilizing a Schottky FEG gun. The system can operate at voltages down to 200V and can accommodate samples up to 200mm in diameter through the loadlock. 300mm wafers can be loaded, although that requires venting the analysis chamber; the center 200mm can be imaged. The sample chamber can accommodate relatively tall samples and the Z-stage has about 40mm travel. The system uses the Gemini column and is equivalent to the current Zeiss Merlin Compact, with upgraded computer and software.
The system has an Oxford 50mm SDD EDX detector and uses Aztec 3.0 software. The chamber geometry sets the EDX analysis height at 8-8.5mm, which allows high lateral resolution and reasonable counts at 5kV using the 120um aperture in High Current mode
To request training or reserve time on this instrument, click here to go the Zeiss Ultra 60 equipment page on SUMS.
Through-wafer via cross-section, partial metal plating
- Resolution: 2.0 nm at 20 kV; 3 nm at 1 kV
- Accelerating voltage range: 0.3-30 kV
- Detectors: SE (Everhart-Thornley); InLens (for low voltage imaging)
- Attachment: Oxford X-Max thin window 50mm SDD Energy Dispersive Spectrometer (EDS) Detector
Calibration Results
Operating Instructions